Industry

New Energy Industrial Cooling System Solution

Thermal management has always been a major problem in industrial system design. With the development of integrated and microelectronic packaging technology, the overall power density of electronic components continues to grow, the physical dimensions tend to be miniaturized. Resulting in increased heat flux density around the integrated devices, affecting performance and safety of electronic components and the equipment. In order to enhance the safety and reliability of industrial systems, there are require a more efficient and reliable cooling solution.

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Reliable, innovative, high-performance and design-intensive advanced thermal solution.

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